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Proceedings Paper

Analysis and modeling of thermal failure based on a MEMS thermally driven structure
Author(s): Xiuhan Li; Quan Yuan; Leijie Lang; Jian Liu; Yu Liu; Dongming Fang; Haixia Zhang
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Paper Abstract

This paper presents an analysis of the thermal failure model of a MEMS thermal driven structure fabricated by MetalMump process. The finite element analysis was used to study the thermal electrical model and the experimental test results were compared with the simulated results. The parameters of the driven current applied on the structure which influence the system stability were considered, including the current value as well as the frequency. Avoiding thermal aggregation leading to structure destruction, the geometry factors of the structure design were also discussed to improve the heat conduction effect.

Paper Details

Date Published: 20 November 2009
PDF: 8 pages
Proc. SPIE 7510, 2009 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 75100L (20 November 2009); doi: 10.1117/12.845904
Show Author Affiliations
Xiuhan Li, Beijing Jiaotong Univ. (China)
Quan Yuan, Peking Univ. (China)
Leijie Lang, Peking Univ. (China)
Jian Liu, Peking Univ. (China)
Yu Liu, Peking Univ. (China)
Dongming Fang, Peking Univ. (China)
Haixia Zhang, Peking Univ. (China)


Published in SPIE Proceedings Vol. 7510:
2009 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications
Zhaoying Zhou; Toshio Fukuda; Helmut Seidel; Xinxin Li; Haixia Zhang; Tianhong Cui, Editor(s)

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