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Proceedings Paper

Study of post develop defect on TC-less immersion resist
Author(s): Masahiko Harumoto; Sadayasu Suyama; Tadashi Miyagi; Akihiro Hisai; Masaya Asai
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Paper Abstract

This study reports on post develop defect on TC-less immersion resist system. There are major defects on TC-less resist system, for example micro-Bridging, Blob and pattern collapse defect, as is well known. Among these defect, we reported Blob and pattern collapse defect could be reduced by Acid rinse involving CO2. However, we also reported there was the difference in the effect for each resist. In this work, we show the great effective and slight effective case for post develop defect and we discuss the cause of difference in acid rinse effect. We evaluated and confirmed the effect on each resist, pattern, exposed area location, develop process and so on. Furthermore, we made a mechanism of defect appearing based on the analysis of defect components and the measurement of resist surface condition for each develop process. Finally we show the novel approach to post develop defect reduction on TC-less immersion resist system.

Paper Details

Date Published: 30 March 2010
PDF: 9 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763920 (30 March 2010); doi: 10.1117/12.845834
Show Author Affiliations
Masahiko Harumoto, SOKUDO Co., Ltd. (Japan)
Sadayasu Suyama, SOKUDO Co., Ltd. (Japan)
Tadashi Miyagi, SOKUDO Co., Ltd. (Japan)
Akihiro Hisai, SOKUDO Co., Ltd. (Japan)
Masaya Asai, SOKUDO Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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