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Proceedings Paper

Recent advances on chip-to-chip optical interconnect
Author(s): Daniel Lu
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Paper Abstract

Copper (Cu) interconnect has been used for communication systems at shorter length scales for both latency and bandwidth sensitive applications. However, as the computational bandwidth of the integrated circuits increases dramatically, Cu interconnect at short distances especially in bandwidth sensitive applications is struggling to keep up. This presents a good opportunity for optical interconnect to penetrate the short distance world. This paper reviews the latest advances of optical interconnect for off-chip high bandwidth communications. The focus will be on the materials and processing aspects for realizing optical interconnects through low cost and manufacturable approaches, especially on various novel schemes to achieve passive optical alignment between optical device and waveguide, and on novel package architectures to achieve high bandwidth using the optical interconnects.

Paper Details

Date Published: 26 October 2009
PDF: 14 pages
Proc. SPIE 7516, Photonics and Optoelectronics Meetings (POEM) 2009: Optoelectronic Devices and Integration, 75160O (26 October 2009); doi: 10.1117/12.845081
Show Author Affiliations
Daniel Lu, Henkel Electronics (China)


Published in SPIE Proceedings Vol. 7516:
Photonics and Optoelectronics Meetings (POEM) 2009: Optoelectronic Devices and Integration
Zishen Zhao; Ray T. Chen; Yong Chen; Jinzhong Yu; Junqiang Sun; Weiwei Dong, Editor(s)

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