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Proceedings Paper

Optical inspection of MOEMS devices using a configurable and suitable for production image processing system
Author(s): M. Scholles; M. Grafe; P. Miskowiec; V. Bock; H. Schenk
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Paper Abstract

This contribution describes a fully automated optical inspection system suited for end test of MOEMS which are fabricated in large volume. The system consists on one hand of necessary handling tools for MOEMS which are not necessarily part of a rigid wafer. On the other hand, a crucial part is an image processing system that can be adapted to changing requirements on accuracy for different parts of one MOEMS device as well as allows easy reconfiguration of the complete image analysis for diverse MOEMS types. First proof of usability has been obtained for micro scanning mirrors developed at Fraunhofer IPMS.

Paper Details

Date Published: 4 February 2010
PDF: 12 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 75920L (4 February 2010); doi: 10.1117/12.845075
Show Author Affiliations
M. Scholles, Fraunhofer Institute for Photonic Microsystems (Germany)
M. Grafe, Fraunhofer Institute for Photonic Microsystems (Germany)
P. Miskowiec, Fraunhofer Institute for Photonic Microsystems (Germany)
V. Bock, Fraunhofer Institute for Photonic Microsystems (Germany)
H. Schenk, Fraunhofer Institute for Photonic Microsystems (Germany)


Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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