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Proceedings Paper

Predicting reliability of silicon MEMS
Author(s): Alissa M. Fitzgerald; David M. Pierce; Benedikt Zeyen
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Paper Abstract

We have developed a method for predicting the reliability of a brittle microstructure. This method enables a MEMS designer to simulate the reliability of a MEMS device and to make design corrections before investing the time and expense of fabrication and development. Our method combines empirical data gathered from fracture of test specimens, analyzed by Weibull methods, and finite element analysis results, in an algorithm that estimates failure probability for a specified load. MEMS devices typically have multiple and varying surface qualities resulting from fabrication processes. In this work, we demonstrate that the accuracy of the prediction method depends on the inclusion of the Weibull parameters for all surface types.

Paper Details

Date Published: 4 February 2010
PDF: 9 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 759208 (4 February 2010); doi: 10.1117/12.845008
Show Author Affiliations
Alissa M. Fitzgerald, A.M. Fitzgerald & Associates, LLC (United States)
David M. Pierce, A.M. Fitzgerald & Associates, LLC (United States)
Benedikt Zeyen, A.M. Fitzgerald & Associates, LLC (United States)


Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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