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Proceedings Paper

Development of integration technology for optical PCB and electrical PCB
Author(s): Doo Yeol Cha; Se Jun Cho; Jai Hyuk Lee; Sung Pil Chang
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Paper Abstract

As the demands for the higher data transmission capacity and speed as well as higher integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. In this paper, among the key technologies to integrate the Electrical PCB with Optical, the technology for getting the via interconnection line with low resistivity using pulse mode electroplating method and bonding technology for high bonding strength with low temperature process are studied. As a result of this study, the measured value of electrical resistivity shows with a range from 20 to 26 mΩ and the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa.

Paper Details

Date Published: 15 February 2010
PDF: 9 pages
Proc. SPIE 7605, Optoelectronic Integrated Circuits XII, 76050U (15 February 2010); doi: 10.1117/12.844663
Show Author Affiliations
Doo Yeol Cha, Inha Univ. (Korea, Republic of)
Se Jun Cho, Inha Univ. (Korea, Republic of)
Jai Hyuk Lee, Inha Univ. (Korea, Republic of)
Sung Pil Chang, Inha Univ. (Korea, Republic of)

Published in SPIE Proceedings Vol. 7605:
Optoelectronic Integrated Circuits XII
Louay A. Eldada; El-Hang Lee, Editor(s)

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