Share Email Print
cover

Proceedings Paper

True bidirectional optical interconnects over multimode fiber
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

We report the fabrication and properties of 850nm wavelength AlGaAs/GaAs-based transceiver chips, in which vertical-cavity surface-emitting lasers (VCSELs) and photodiodes are monolithically integrated. Various types of devices allow half- and full-duplex bidirectional optical interconnection at multiple Gbit/s data rates over a single butt-coupled glass or polymer-clad silica optical fiber with core diameters of 100 or 200 μm. Whereas metal-semiconductor-metal (MSM) photodiodes are employed for these large-area fibers, we also investigate the integration of PIN-type photodiodes which appear more promising in combination with standard 62.5 or 50 μm core diameter graded-index multimode fibers. This interconnect solution based on two identical chips is attractive owing to lower volume, weight, and cost. Applications will be found in home, in-building, industrial, or automotive networks and potentially within computer clusters or central offices.

Paper Details

Date Published: 16 February 2010
PDF: 17 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070B (16 February 2010); doi: 10.1117/12.844119
Show Author Affiliations
Rainer Michalzik, Univ. Ulm (Germany)
Alexander Kern, Univ. Ulm (Germany)
Martin Stach, Univ. Ulm (Germany)
Fernando Rinaldi, Univ. Ulm (Germany)
Dietmar Wahl, Univ. Ulm (Germany)


Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top