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Proceedings Paper

Wafer-level vacuum/hermetic packaging technologies for MEMS
Author(s): Sang-Hyun Lee; Jay Mitchell; Warren Welch; Sangwoo Lee; Khalil Najafi
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Paper Abstract

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

Paper Details

Date Published: 5 February 2010
PDF: 10 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 759205 (5 February 2010); doi: 10.1117/12.843831
Show Author Affiliations
Sang-Hyun Lee, Univ. of Michigan (United States)
ePack, Inc. (United States)
Jay Mitchell, Univ. of Michigan (United States)
ePack, Inc. (United States)
Warren Welch, Intek, Inc. (United States)
Sangwoo Lee, Univ. of Michigan (United States)
ePack, Inc. (United States)
Khalil Najafi, Univ. of Michigan (United States)


Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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