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Proceedings Paper

Optical link between FPGA microprocessors using a fiber-embedded rigid PCB
Author(s): Do-Won Kim; Tae-Woo Lee; Dong-Min Im; Mu Hee Cho; Min-Hyuk Lee; Jae-Bong Choi; Hyo-Hoon Park
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Paper Abstract

A platform for video data link between FPGA microprocessors based on an optical printed-circuit board (OPCB) was implemented. Optimized compact size of 9.5 x 10.5 x 1.0 mm3 Tx/Rx modules were prepared and applied for the optical link of the platform. A low insertion loss of 0.42 dB and stable optical fiber-layer integrated with connectors was embedded in FR4 board for the implementation of the OPCB. The platform shows that embedding the optical fiber-layer with connectors can improve the degree of freedom for packaging as well as optical and physical characteristics. Real time video image from a charge-coupled-device (CCD) camera was successfully transmitted to a monitor through optical link between FPGA microprocessors of the platform. The captured image was successfully saved in a static random access memory (SRAM) and clearly shown on the monitor. This study shows that chip-to-chip optical interconnection technology based on fiber-layer embedded OPCB can be applied for the CPU-to-CPU/memory optical interconnections.

Paper Details

Date Published: 23 February 2010
PDF: 8 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070Q (23 February 2010); doi: 10.1117/12.843146
Show Author Affiliations
Do-Won Kim, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Tae-Woo Lee, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Dong-Min Im, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Mu Hee Cho, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Min-Hyuk Lee, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Jae-Bong Choi, LG Micron Ltd. (Korea, Republic of)
Hyo-Hoon Park, Korea Advanced Institute of Science and Technology (Korea, Republic of)


Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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