Share Email Print
cover

Proceedings Paper

Generic packaging concepts in the frame of network of excellence ePIXnet
Author(s): Tolga Tekin; Lars Zimmermann; Henning Schröder; Pieter Dumon; Wim Bogaerts; Jose Vicente Galan; Pablo Sanchis; William Whelan-Curtin; Daryl Beggs
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.

Paper Details

Date Published: 11 February 2010
PDF: 10 pages
Proc. SPIE 7604, Integrated Optics: Devices, Materials, and Technologies XIV, 76040I (11 February 2010); doi: 10.1117/12.842999
Show Author Affiliations
Tolga Tekin, Technische Univ. Berlin (Germany)
Lars Zimmermann, Technische Univ. Berlin (Germany)
Henning Schröder, Fraunhofer IZM (Germany)
Pieter Dumon, Ghent Univ. (Belgium)
Wim Bogaerts, Ghent Univ. (Belgium)
Jose Vicente Galan, Univ. Politécnica de Valencia (Spain)
Pablo Sanchis, Univ. Politécnica de Valencia (Spain)
William Whelan-Curtin, Univ. of St. Andrews (United Kingdom)
Daryl Beggs, Univ. of St. Andrews (United Kingdom)


Published in SPIE Proceedings Vol. 7604:
Integrated Optics: Devices, Materials, and Technologies XIV
Jean-Emmanuel Broquin; Christoph M. Greiner, Editor(s)

© SPIE. Terms of Use
Back to Top