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Proceedings Paper

System-in-package technologies for photonics
Author(s): Tolga Tekin
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Paper Abstract

System-in-package technology is announced as one of the key technologies, which enables the continued increase in functional density and decrease in cost per function required to maintain the progress of electronics by utilizing 3D through innovation in packaging and interconnect technology. A key bottleneck to the realization of high-performance microelectronic systems is the lack of low latency, high-bandwidth, and high density off-chip interconnects. Photonics could overcome these challenges and leverage low-latency and high bandwidth communication within next generation architectures. In this paper state-of-the-art approaches will be discussed and the requirements in 3D integration perspective of converging platforms will be addressed.

Paper Details

Date Published: 16 February 2010
PDF: 12 pages
Proc. SPIE 7605, Optoelectronic Integrated Circuits XII, 760506 (16 February 2010); doi: 10.1117/12.842939
Show Author Affiliations
Tolga Tekin, TU Berlin Microperipheric Technologies (Germany)


Published in SPIE Proceedings Vol. 7605:
Optoelectronic Integrated Circuits XII
Louay A. Eldada; El-Hang Lee, Editor(s)

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