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Proceedings Paper

Ultralow-power silicon photonic interconnect for high-performance computing systems
Author(s): GuoLiang Li; Xuezhe Zheng; Jon Lexau; Ying Luo; Hiren Thacker; Thierry Pinguet; Po Dong; Dazeng Feng; Shirong Liao; Roshanak Shafiiha; Mehdi Asghari; Jin Yao; Jing Shi; Ivan N. Shubin; Dinesh Patil; Frankie Liu; Kannan Raj; Ron Ho; John E. Cunningham; Ashok V. Krishnamoorthy
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Paper Abstract

The Ultra-performance Nanophotonic Intrachip Communication (UNIC) project aims to achieve unprecedented high-density, low-power, large-bandwidth, and low-latency optical interconnect for highly compact supercomputer systems. This project, which has started in 2008, sets extremely aggressive goals on power consumptions and footprints for optical devices and the integrated VLSI circuits. In this paper we will discuss our challenges and present some of our first-year achievements, including a 320 fJ/bit hybrid-bonded optical transmitter and a 690 fJ/bit hybrid-bonded optical receiver. The optical transmitter was made of a Si microring modulator flip-chip bonded to a 90nm CMOS driver with digital clocking. With only 1.6mW power consumption measured from the power supply voltages and currents, the transmitter exhibits a wide open eye with extinction ratio >7dB at 5Gb/s. The receiver was made of a Ge waveguide detector flip-chip bonded to a 90nm CMOS digitally clocked receiver circuit. With 3.45mW power consumption, the integrated receiver demonstrated -18.9dBm sensitivity at 5Gb/s for a BER of 10-12. In addition, we will discuss our Mux/Demux strategy and present our devices with small footprints and low tuning energy.

Paper Details

Date Published: 15 February 2010
PDF: 15 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 760703 (15 February 2010); doi: 10.1117/12.842884
Show Author Affiliations
GuoLiang Li, Sun Microsystems, Inc. (United States)
Xuezhe Zheng, Sun Microsystems, Inc. (United States)
Jon Lexau, Sun Microsystems, Inc. (United States)
Ying Luo, Sun Microsystems, Inc. (United States)
Hiren Thacker, Sun Microsystems, Inc. (United States)
Thierry Pinguet, Luxtera, Inc. (United States)
Po Dong, Kotura, Inc. (United States)
Dazeng Feng, Kotura, Inc. (United States)
Shirong Liao, Kotura, Inc. (United States)
Roshanak Shafiiha, Kotura, Inc. (United States)
Mehdi Asghari, Kotura, Inc. (United States)
Jin Yao, Sun Microsystems, Inc. (United States)
Jing Shi, Sun Microsystems, Inc. (United States)
Ivan N. Shubin, Sun Microsystems, Inc. (United States)
Dinesh Patil, Sun Microsystems, Inc. (United States)
Frankie Liu, Sun Microsystems, Inc. (United States)
Kannan Raj, Sun Microsystems, Inc. (United States)
Ron Ho, Sun Microsystems, Inc. (United States)
John E. Cunningham, Sun Microsystems, Inc. (United States)
Ashok V. Krishnamoorthy, Sun Microsystems, Inc. (United States)

Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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