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Proceedings Paper

A 2-DOF MEMS positioning system
Author(s): Ganapathy Sivakumar; James Mathews; Tim E. Dallas
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Paper Abstract

We report on the design, fabrication, and testing of a 2 degree of freedom MEMS positioning system. Sandia National Laboratories' MEMS foundry process was utilized for the fabrication of the device; this process incorporates five layers of polysilicon and four sacrificial layers of silicon dioxide. The actuation was achieved by identical comb-drives on both axes. The comb drives produce a displacement of ~ 4 μm which was amplified to ~ 30 μm by the use of a distance multiplier. A pin and track arrangement in the X and Y arms, extending from the actuator assembly, allows bi-axis motion. The stage is connected to the central pin. For testing the performance of the fabricated design a custom made optical characterization setup was assembled. To provide the actuation signals to the stage, a Keithley 2400 source meter was programmed using LabView to provide actuation voltages from 0-100 V with a 2 volt step. An optical microscope, interfaced with a Canon S5 IS digital camera, was used to record the actuation events for the measurement of in-plane displacement. Displacement at the various actuation voltages was obtained using a National Instruments' Vision image analysis software routine. The device has been tested and demonstrates a useful design for realizing a bi-directional 2-D positioning system. The positioning system is capable of 0 - 30 μm of motion in both the X and Y axes, with displacement showing a quadratic relationship with the applied voltage.

Paper Details

Date Published: 17 February 2010
PDF: 7 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 75920S (17 February 2010); doi: 10.1117/12.842435
Show Author Affiliations
Ganapathy Sivakumar, Texas Tech Univ. (United States)
James Mathews, Angelo State Univ. (United States)
Tim E. Dallas, Texas Tech Univ. (United States)


Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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