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Proceedings Paper

Reliability study of a MEMS array under varying temperature and humidity conditions
Author(s): Ganapathy Sivakumar; Ranjith Ranganathan; Richard Gale; Tim Dallas
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Paper Abstract

In this work, we quantify and analyze the rate of accrual of stiction and mechanical fatigue in a MEMS micro-mirror device to understand its reliability under a set of controlled temperature and humidity splits. An accelerated aging system was employed by using a non-standard actuation procedure to more rapidly induce failure of the micro-mirrors. The array is hermetically packaged with a low surface energy self-assembled-monolayer (SAM) based anti-stiction coating, along with an encapsulated source of this anti-stiction coating that serves as a reservoir. Exposure of the micro-mirror array to the environmental conditions was made possible by drilling two 1 mm holes in the hermetic package. This enabled the retention of the encapsulated SAM source in the package which was vital to understanding the effects of SAM re-deposition on the surface in the operating environment. The fastest accrual of stiction was seen in the 90°C, 80% RH split with approximately 80% of the micro-mirrors failing within 4.4 × 109 cycles (10 hours) with 2.7×10-14 Joules of Stiction Equivalent Energy while the 60°C, 20% RH showed the least stiction accrual rate with less than 2% failure for 2.26×1012 cycles (1500 hours). The failure data obtained from the experiments were used to do a reliability analysis by utilizing the Weibull distribution.

Paper Details

Date Published: 5 February 2010
PDF: 9 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 75920C (5 February 2010); doi: 10.1117/12.842384
Show Author Affiliations
Ganapathy Sivakumar, Texas Tech Univ. (United States)
Ranjith Ranganathan, Texas Tech Univ. (United States)
Richard Gale, Texas Tech Univ. (United States)
Tim Dallas, Texas Tech Univ. (United States)


Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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