Share Email Print
cover

Proceedings Paper

Through-wafer interconnects for high degree of freedom MEMS deformable mirrors
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The development of an assembly and packaging process for MEMS deformable mirrors (DMs) with through wafer via (TWV) interconnects is presented. The approach consists of attaching a DM die with high-density TWV electrostatic actuator interconnects to an interposer substrate that fans out these connections for interfacing to conventional packaging technology.

Paper Details

Date Published: 18 February 2010
PDF: 12 pages
Proc. SPIE 7595, MEMS Adaptive Optics IV, 75950N (18 February 2010); doi: 10.1117/12.842341
Show Author Affiliations
Alioune Diouf, Boston Univ. Photonics Ctr. (United States)
Thomas G. Bifano, Boston Univ. Photonics Ctr. (United States)
Jason B. Stewart, Boston Micromachines Corp. (United States)
Steven Cornelissen, Boston Micromachines Corp. (United States)
Paul Bierden, Boston Micromachines Corp. (United States)


Published in SPIE Proceedings Vol. 7595:
MEMS Adaptive Optics IV
Scot S. Olivier; Thomas G. Bifano; Joel A. Kubby, Editor(s)

© SPIE. Terms of Use
Back to Top