Share Email Print
cover

Proceedings Paper

200Gb/s 10-channel miniature optical interconnect transmitter module for high-performance computing (HPC)
Author(s): Edris Mohammed; Hinmeng Au
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A major breakthrough to alleviating the interconnect bottleneck in intra cabinet system in HPC may happen by bringing optics directly to the processor package. In order to do so efficient and compact optical interconnect subassembly modules that utilize simple optical and electrical interfacing schemes are needed. In our current work the development of a novel 10-channel, miniature 7mm(W)x1.8mm(L)x3mm(H), optical interconnect transmitter subassembly module is described. The module consists of a high precision molded optical alignment unit with integrated microlens arrays, highspeed coplanar waveguide (CPW) electrical interfaces and a VCSEL (Vertical Cavity Surface Emitting Laser) array chip which is flip chip mounted. The module is designed to uniquely interface vertically with high-speed electrical I/O lines on a microprocessor style package or a motherboard to convert electrical signals to optical for transmission to other similar units using a standard (Multi-Terminal) MT style optical connector. We report on optical coupling efficiency, misalignment tolerance and high-speed electrical and optical measurements of the module. We have measured 40Gb/s electrical eye for the CPW interfaces on the module and 20Gb/s clear optical eyes for VCSEL assembled module from all the 10 channels to produce an aggregate transmitter bandwidth of 200Gb/s. We also measured 30Gb/s electrical and 20Gb/s optical eyes for the optical subassembly module that is bonded onto a microprocessor style package substrate.

Paper Details

Date Published: 16 February 2010
PDF: 12 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 760709 (16 February 2010); doi: 10.1117/12.842229
Show Author Affiliations
Edris Mohammed, Intel Corp. (United States)
Hinmeng Au, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top