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Proceedings Paper

Packaging of opto-electronic devices for flexible applications
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Paper Abstract

This paper presents the latest results on the development of a thin flexible package of commercially available optoelectronics with polymer multimode waveguides. The GaAs VCSELs and Photodiodes are thinned down to 20 μm thickness, resulting in packages which can be bended to a bending radius of 2 mm with high reliability. With these actives, also waveguides and out-of-plane coupling structures are embedded inside the foil. Flexible Polyimide micromirrors were fabricated, characterized and embedded inside the foil. An embedded VCSEL to Photodiode optical waveguide link was demonstrated at a speed of 1.2 Gbs with open eye diagram. Temperature (-40 to 125 degrees Celsius) and humidity (85 rh/85 °C for 1000 hours) reliability was tested with good results. The total thickness of the completed foil containing actives, waveguides and coupling elements is only 145 μm.

Paper Details

Date Published: 16 February 2010
PDF: 10 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070G (16 February 2010); doi: 10.1117/12.841553
Show Author Affiliations
Erwin Bosman, CMST Microsystems, Univ. Gent (Belgium)
Geert Van Steenberge, CMST Microsystems, Univ. Gent (Belgium)
Jeroen Missine, CMST Microsystems, Univ. Gent (Belgium)
Bram Van Hoe, CMST Microsystems, Univ. Gent (Belgium)
Peter Van Daele, CMST Microsystems, Univ. Gent (Belgium)

Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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