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Proceedings Paper

Laser-based joining for the packaging of miniature optoelectronic devices
Author(s): Duncan P. Hand; Norbert Lorenz; Martin D. Smith; Suzanne Millar; Marc Desmulliez
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Paper Abstract

In recent years various techniques have been developed for the manufacture of microsystems and other miniature optoelectronic devices. One aspect where there remains significant room for improvement is the packaging process. Standard packaging techniques involve heating whole devices to high temperatures, in some cases combined with strong electric fields, preventing the use of temperature-sensitive materials within the package and generating problems in manufacturing processes where a number of thermal process steps are carried out sequentially, when a later heating step can cause parts joined earlier to disassemble. Here we describe the successful application of laser-based joining for the packaging of such devices.

Paper Details

Date Published: 23 February 2010
PDF: 10 pages
Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758504 (23 February 2010); doi: 10.1117/12.841280
Show Author Affiliations
Duncan P. Hand, Heriot-Watt Univ. (United Kingdom)
Norbert Lorenz, Heriot-Watt Univ. (United Kingdom)
Martin D. Smith, Heriot-Watt Univ. (United Kingdom)
Suzanne Millar, Heriot-Watt Univ. (United Kingdom)
Marc Desmulliez, Heriot-Watt Univ. (United Kingdom)


Published in SPIE Proceedings Vol. 7585:
Laser-based Micro- and Nanopackaging and Assembly IV
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Jun Amako; Willem Hoving, Editor(s)

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