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Proceedings Paper

Effects of nanoparticles on hygrothermal property of epoxy resin composites
Author(s): Xinying Lv; Rongguo Wang; Wenbo Liu
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Paper Abstract

Polymer composites are widely used in aerospace field, especially carbon fiber reinforced epoxy resin composites, because of the outstanding performance, became the most popular polymer matrix composites. However, the hygrothermal property of epoxy resin, as the matrix of the structure composite, is crucial to the whole composites. In this paper, the main focus is to modify the epoxy resin with nano-SiO2 and nano-TiO2 to enhance the hygrothermal property. Ultrasonic dispersion technology was used to prepare the nano-TiO2 and nano-SiO2 epoxy resin composites. The two kinds of composites were disposed in the climatic chamber for constant conditions. The effect of nano-particles on the hygrothermal property of epoxy resin composites were investigated by dynamic mechanics analysis (DMA) and mechanical properties testing. SEM images were taken to characterize the decentralization of the nano-particles in the composites. It is shown that nano-particles can be dispersed uniformly in the epoxy resin by ultrasonic dispersion. Thermo-analysis and mechanical testing results were presented that the epoxy nanocomposites has the excellent hygrothermal property under the same aging condition. Accordingly, the modified epoxy resin matrix can be used to prepare carbon fiber reinforced composites with remarkable hygrothermal property.

Paper Details

Date Published: 21 October 2009
PDF: 7 pages
Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74933E (21 October 2009); doi: 10.1117/12.841093
Show Author Affiliations
Xinying Lv, Harbin Institute of Technology (China)
Northeast Forestry Univ. (China)
Rongguo Wang, Harbin Institute of Technology (China)
Wenbo Liu, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 7493:
Second International Conference on Smart Materials and Nanotechnology in Engineering

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