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Proceedings Paper

Characterization of Au/Au, Au/Ru, and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology
Author(s): Adrien Broue; Jérémie Dhennin; Frédéric Courtade; Christel Dieppedale; Patrick Pons; Xavier Lafontan; Robert Plana
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Paper Abstract

Comparisons between several pairs of contact materials have been done with a new methodology using a commercial nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate the micro-scale contact physics. Experimental measurements are obtained to characterize the response of a 5 μm2 square contact bump under electromechanical stress with increased applied current. The data provide a better understanding of micro-contact behaviour related to the impact of current at low- to medium-power levels. Contact temperature rise is observed, leading to shifts of the mechanical properties of contact materials and modifications of the contact surface. The stability of the contact resistance, when the contact force increases, is studied for contact pairs of soft (Au/Au contact), harder (Ru/Ru contact) and mixed material configuration (Au/Ru contact). An enhanced stability of the bimetallic contact Au/Ru is demonstrated considering sensitivity to power increase, related to creep effects and topological modifications of the contact surfaces. These results are compared to previous ones and discussed in a theoretical way by considering the temperature distribution around the hottest area at the contact interface.

Paper Details

Date Published: 4 February 2010
PDF: 12 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 75920A (4 February 2010); doi: 10.1117/12.840979
Show Author Affiliations
Adrien Broue, NOVA MEMS (France)
LAAS, CNRS, Univ. de Toulouse (France)
Jérémie Dhennin, NOVA MEMS (France)
Frédéric Courtade, CNES (France)
Christel Dieppedale, CEA-LETI (France)
Patrick Pons, LAAS, CNRS, Univ. de Toulouse (France)
Xavier Lafontan, NOVA MEMS (France)
INTESENS (France)
Robert Plana, LAAS, CNRS, Univ. de Toulouse (France)


Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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