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Proceedings Paper

Use of conductive adhesive for MEMS interconnection in military fuze applications
Author(s): Jakob Gakkestad; Per Dalsjo; Helge Kristiansen; Rolf Johannessen; Maaike M. Visser Taklo
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Paper Abstract

A novel conductive adhesive has been used to interconnect MEMS test structures with different pad sizes directly to a PCB in a medium caliber ammunition fuze. The fuze environment is very demanding with a setback acceleration exceeding 60 000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures have been subjected to rapid temperature cycling according to MIL-STD 883G method 1010.8 test condition B and performed well. The test structures with the largest pad sizes passed 100 temperature cycles and firing test where the test structures have been exposed to an acceleration of more than 60 000 g.

Paper Details

Date Published: 4 February 2010
PDF: 11 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 75920I (4 February 2010); doi: 10.1117/12.840890
Show Author Affiliations
Jakob Gakkestad, Norwegian Defence Research Establishment (Norway)
Per Dalsjo, Norwegian Defence Research Establishment (Norway)
Helge Kristiansen, Conpart AS (Norway)
Rolf Johannessen, SINTEF ICT (Norway)
Maaike M. Visser Taklo, SINTEF ICT (Norway)

Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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