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Proceedings Paper

Electrode micropatterning by microcontact printing method to large area substrates using nickel mold
Author(s): Atsushi Takakuwa; Takeshi Shibuya; Kiyoshi Yase
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Paper Abstract

Microcontact printing (μCP) was successfully used to micropattern electrodes on large area substrates. An A4-size (210 mm × 297 mm) polydimethylsiloxane (PDMS) elastomer stamp was easily fabricated using an electroformed nickel mold. The micropatterns of poly(3,4-ethylenedioxythiophene)/poly(4-stylenesulfonate) (PEDOT/PSS) and silver (Ag) thin films, which were under 10 μm in width, were fabricated by transferring the thin films on the PDMS elastomer stamp to another substrate by μCP. Bottom contact (BC) organic thin film transistors (OTFTs) with PEDOT/PSS were fabricated as source and drain electrodes. The successful operation of fabricated OTFTs with a channel length of 10 μm was demonstrated. Results show that μCP is a promising process for use with various devices that require micropatterning on large area substrates.

Paper Details

Date Published: 17 February 2010
PDF: 8 pages
Proc. SPIE 7590, Micromachining and Microfabrication Process Technology XV, 75900N (17 February 2010); doi: 10.1117/12.840588
Show Author Affiliations
Atsushi Takakuwa, Japan Chemical Innovation Institute (Japan)
Seiko Epson Corp. (Japan)
Takeshi Shibuya, Japan Chemical Innovation Institute (Japan)
Ricoh Co., Ltd. (Japan)
Kiyoshi Yase, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 7590:
Micromachining and Microfabrication Process Technology XV
Mary Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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