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Proceedings Paper

Micromachining of thin glass plates with a femtosecond laser
Author(s): D. Hélie; R. Vallée
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Paper Abstract

We present a novel method for cutting thin borosilicate glass slides, as well as other results pertaining to laser welding related to an existing technique. Based on the concept of stealth dicing for semiconductor wafers, we have demonstrated that by giving our samples an initial stress and by creating optically induced defects inside the glass, it is possible to efficiently cut a thin glass substrate. The edges are sharp along the whole length of the cut and exempt from debris deposition and deformations. We have also perfected a femtosecond laser welding technique to join borosilicate glass samples with very distinct welded regions.

Paper Details

Date Published: 4 August 2009
PDF: 11 pages
Proc. SPIE 7386, Photonics North 2009, 738639 (4 August 2009); doi: 10.1117/12.840553
Show Author Affiliations
D. Hélie, COPL, Univ. Laval (Canada)
R. Vallée, COPL, Univ. Laval (Canada)

Published in SPIE Proceedings Vol. 7386:
Photonics North 2009
Réal Vallée, Editor(s)

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