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Proceedings Paper

Submicron accuracy optimization for laser beam soldering processes
Author(s): Erik Beckert; Thomas Burkhardt; Marcel Hornaff; Andreas Kamm; Ingo Scheidig; Cornelia Stiehl; Ramona Eberhardt; Andreas Tünnermann
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Paper Abstract

Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent requirements for accuracy in the micron and submicron range. Investigating the assembly of several laser optical systems it has been shown that micron accuracy and submicron reproducibility can be reached when using design-of-experiment optimized solder processes that are based on applying liquid solder drops ("Solder Bumping") onto wettable metalized joining surfaces of optical components. The soldered assemblies were subject to thermal cycles and vibration/ shock test also.

Paper Details

Date Published: 23 February 2010
PDF: 11 pages
Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758505 (23 February 2010); doi: 10.1117/12.840495
Show Author Affiliations
Erik Beckert, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Thomas Burkhardt, Friedrich-Schiller-Univ. Jena (Germany)
Marcel Hornaff, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Andreas Kamm, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Ingo Scheidig, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Cornelia Stiehl, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Ramona Eberhardt, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Andreas Tünnermann, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)
Friedrich-Schiller-Univ. Jena (Germany)


Published in SPIE Proceedings Vol. 7585:
Laser-based Micro- and Nanopackaging and Assembly IV
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Jun Amako; Willem Hoving, Editor(s)

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