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Proceedings Paper

Adhesion strength of norbornene-based self-healing agents to an amine-cured epoxy
Author(s): Guang Chun Huang; Jong Keun Lee; Michael R. Kessler; Sungho Yoon
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Paper Abstract

Self-healing is triggered by crack propagation through embedded microcapsules in an epoxy matrix, which then release the liquid healing agent into the crack plane. Subsequent exposure of the healing agent to the chemical catalyst initiates ring-opening metathesis polymerization (ROMP) and bonding of the crack faces. In order to improve self-healing functionality, it is necessary to enhance adhesion of polymerized healing agent within the crack to the matrix resin. In this study, shear bond strength between different norbornene-based healing agents and an amine-cured epoxy resin was evaluated using the single lap shear test method (ASTM D3163, modified). The healing agents tested include endodicyclopentadiene (endo-DCPD), 5-ethylidene-2-norbornene (ENB) and DCPD/ENB blends. 5-Norbornene-2-methanol (NBM) was used as an adhesion promoter, containing hydroxyl groups to form hydrogen bonds with the amine-cured epoxy. A custom synthesized norbornene-based crosslinking agent was also added to improve adhesion for ENB by increasing the crosslinking density of the adhesive after ROMP. The healing agents were polymerized with varying loadings of the 1st generation Grubbs' catalyst at different reaction times and temperatures.

Paper Details

Date Published: 20 October 2009
PDF: 7 pages
Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74935E (20 October 2009); doi: 10.1117/12.840356
Show Author Affiliations
Guang Chun Huang, Kumoh National Institute of Technology (Korea, Republic of)
Jong Keun Lee, Kumoh National Institute of Technology (Korea, Republic of)
Michael R. Kessler, Iowa State Univ. (United States)
Sungho Yoon, Kumoh National Institute of Technology (Korea, Republic of)


Published in SPIE Proceedings Vol. 7493:
Second International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Anand K. Asundi; Wolfgang Ecke, Editor(s)

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