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Proceedings Paper

Effects of self-healing microcapsules on bending performance in composite brake pads
Author(s): Li Zhang; Xiu-ping Dong; Hui Wang
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Paper Abstract

For the purpose of reducing self-weight, friction noise and cost, improving shock absorption, enhancing corrosion and wear resistance, brake pads made of composite materials with self-healing function are prepared to substitute metal ones by designing ingredients and applying optimized production technology. As self-healing capsules are chosen, new method with technology of self-healing microcapsules, dicyclpentadiene (DCPD) microcapsules coated with poly (urea-formaldehyde), is put forward in this paper. In the crack's extending process, the stress is concentrated at the crack end, where the microcapsule is designed to be located. When the stress goes through the microcapsules and causes them to break, the self-healing liquid runs out to fill the crack by the capillary and it will poly-react with catalyst in the composite. As a result, the crack is healed. In this paper, polymer matrix composite brake pads with 6 prescriptions are prepared and studied. Three-point bending tests are carried out according to standards in GB/T 3356-1999 and the elastic constants of these polymer matrix composites are obtained by experiments. In accordance with the law of the continuous fiber composite, elastic constants of the short-fiber composite can be calculated by proportions of each ingredient. Results show that the theoretical expected results and the experimental values are consistent. 0.3-1.2 % mass proportion of microcapsules has little effects on the composite's bending intensity and modulus of elasticity. These studies also show that self-healing microcapsules used in composite brake pads is feasible.

Paper Details

Date Published: 21 October 2009
PDF: 6 pages
Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74935B (21 October 2009); doi: 10.1117/12.840320
Show Author Affiliations
Li Zhang, Beijing Technology and Business Univ. (China)
Xiu-ping Dong, Beijing Technology and Business Univ. (China)
Hui Wang, Beijing Technology and Business Univ. (China)


Published in SPIE Proceedings Vol. 7493:
Second International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Anand K. Asundi; Wolfgang Ecke, Editor(s)

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