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Proceedings Paper

Multilayer metal micromachining for THz waveguide fabrication
Author(s): Adam Rowen; Andrew E. Hollowell; Michael Wanke; Christopher D. Nordquist; Christian Arrington; Rusty Gillen; Jonathan J. Coleman
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Paper Abstract

Thick multi-layer metal stacking offers the potential for fabrication of rectangular waveguide components, including horn antennas, couplers, and bends, for operation at terahertz frequencies, which are too small to machine traditionally. Air-filled, TE10, rectangular waveguides for 3 THz operation were fabricated using two stacked electroplated gold layers on both planar and non-planar substrates. The initial layer of lithography and electroplating defined 37 micrometer tall waveguide walls in both straight and meandering geometries. The second layer, processed on top of the first, defined 33 micrometer thick waveguide lids. Release holes periodically spaced along the center of the lids improved resist clearing from inside of the electroformed rectangular channels. Processing tests of hollow structures on optically clear, lithium disilicate substrates allowed confirmation of resist removal by backside inspection.

Paper Details

Date Published: 17 February 2010
PDF: 12 pages
Proc. SPIE 7590, Micromachining and Microfabrication Process Technology XV, 759009 (17 February 2010); doi: 10.1117/12.840247
Show Author Affiliations
Adam Rowen, Sandia National Labs. (United States)
Andrew E. Hollowell, Sandia National Labs. (United States)
Michael Wanke, Sandia National Labs. (United States)
Christopher D. Nordquist, Sandia National Labs. (United States)
Christian Arrington, LMATA Government Services, LLC (United States)
Rusty Gillen, Sandia National Labs. (United States)
Jonathan J. Coleman, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 7590:
Micromachining and Microfabrication Process Technology XV
Mary Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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