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Proceedings Paper

Calculation of dynamic stress intensity factor of an interfacial crack under moving impacting loading
Author(s): Jin Cheng; Baoke Guo; Li Zhang
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Paper Abstract

Multi-layered structures and composite materials have been used broadly and many defects between interfaces are inevitably in them. Among of the defects, the crack plays an important role for the damage of the structures. In practices, surfaces of interfacial cracks often produce complicated impact each other under external loadings. These additional loadings due to the impacting have great effects to the damage of the structures containing cracks. In this study, dynamic stress intensity factors of an interfacial crack between two homogeneous isotropic half infinite mediums are calculated. Other external loadings are neglected and the only load due to closures or frictions of the crack surfaces is assumed to be a pair of anti-plane moving impacting loading with constant velocity. Fourier and Laplace transforms are employed to simplify general wave equation into ordinary differential equation. Consider the zero initial condition and radiation conditions in far-fields, the solution in double transform domains is obtained. The Cauchy singular integral equation of dislocation density function (DDF) is then derived through Fourier integral inversion. By expanding DDF into Jacobi polynomials with a weight function, the DDF in Laplace transform domain is obtained numerically, and dynamic stress intensity factors of crack tips are expressed using the DDF. To determine the dynamic stress intensity factors in time domain, the Guy Miller method for Laplace inversion is used. Finally, a simple example is analyzed and the dynamic stress intensity factors are displayed graphically.

Paper Details

Date Published: 20 October 2009
PDF: 7 pages
Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74936O (20 October 2009); doi: 10.1117/12.840099
Show Author Affiliations
Jin Cheng, Harbin Institute of Technology (China)
Baoke Guo, Harbin Institute of Technology (China)
Li Zhang, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 7493:
Second International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Anand K. Asundi; Wolfgang Ecke, Editor(s)

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