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Proceedings Paper

High speed deformation measurement of electronic packages by the digital image correlation method
Author(s): Jiangang Li; Fei Qin; Tong An; Ling Jin
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Paper Abstract

4-point dynamic bending tests of board level electronics packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data.

Paper Details

Date Published: 25 August 2009
PDF: 5 pages
Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737558 (25 August 2009); doi: 10.1117/12.839335
Show Author Affiliations
Jiangang Li, Beijing Univ. of Technology (China)
Fei Qin, Beijing Univ. of Technology (China)
Tong An, Beijing Univ. of Technology (China)
Ling Jin, Beijing Univ. of Technology (China)


Published in SPIE Proceedings Vol. 7375:
ICEM 2008: International Conference on Experimental Mechanics 2008
Xiaoyuan He; Huimin Xie; YiLan Kang, Editor(s)

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