Share Email Print
cover

Proceedings Paper

Research on the structure stress analysis based on IR lock-in thermography
Author(s): Junyan Liu; Yang Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper describes a theoretical and experimental analysis on full-filed stress distribution from thermoelastic measurements and its application to determination of stress concentration. The sum of the principle stress can be measured by TSA. The IR Lock in Thermography has been applied to measure the structure stress distribution by its high thermal resolving. In this study, the thermoelastic effect model is developed to study the relationship between the temperature and the applied stress in an elastic material. The FEM is used to study the thermodynamic effect with classical thermoelastic equation, and the valid condition is obtained that the adiabatic loading conditions prevail. The applied loading frequency directly effect on the adiabatic loading conditions for given elastic material. The experiment was carried out with carbon steel structure with a hole for various loading frequency by Lock in thermography. The experimental results show the stress distribution can be measure and a factor is obtained to measure stress in the non-adiabatic conditions (Low loading frequency). It was found that the structure stress can be evaluated with good accuracies by the lock in thermography.

Paper Details

Date Published: 24 August 2009
PDF: 7 pages
Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73752O (24 August 2009); doi: 10.1117/12.839225
Show Author Affiliations
Junyan Liu, Harbin Institute of Technology (China)
Yang Wang, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 7375:
ICEM 2008: International Conference on Experimental Mechanics 2008
Xiaoyuan He; Huimin Xie; YiLan Kang, Editor(s)

© SPIE. Terms of Use
Back to Top