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Proceedings Paper

Analysis of the nano-deformation fields of micro-crack in silicon by high-resolution transmission electron microscopy
Author(s): Q. Gu; C. W. Zhao; H. Q. Jing; Y. M. Xing
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Paper Abstract

A nanoscale experimental study of micro-crack in silicon was presented by using a combination of high-resolution transmission electron microscopy and geometric phase analysis. The results show that there is an amorphous phase content in the crack body. The width of the amorphous narrow band which exists within the crack body is 2nm approximately. The geometric phase analysis technology was applied to calculate the strain fields of the crack tip. The trend of the experiment strain value ahead of the crack tip is the same with the trend of the isotropic elastic theory strain value.

Paper Details

Date Published: 24 August 2009
PDF: 6 pages
Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73750C (24 August 2009); doi: 10.1117/12.839015
Show Author Affiliations
Q. Gu, Inner Mongolia Univ. of Technology (China)
C. W. Zhao, Inner Mongolia Univ. of Technology (China)
H. Q. Jing, Inner Mongolia Univ. of Technology (China)
Y. M. Xing, Inner Mongolia Univ. of Technology (China)


Published in SPIE Proceedings Vol. 7375:
ICEM 2008: International Conference on Experimental Mechanics 2008
Xiaoyuan He; Huimin Xie; YiLan Kang, Editor(s)

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