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Proceedings Paper

Reliability assessment of long span bridges based on structural health monitoring: application to Yonghe Bridge
Author(s): Shunlong Li; Hui Li; Jinping Ou; Hongwei Li
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Paper Abstract

This paper presents the reliability estimation studies based on structural health monitoring data for long span cable stayed bridges. The data collected by structural health monitoring system can be used to update the assumptions or probability models of random load effects, which would give potential for accurate reliability estimation. The reliability analysis is based on the estimated distribution for Dead, Live, Wind and Temperature Load effects. For the components with FBG strain sensors, the Dead, Live and unit Temperature Load effects can be determined by the strain measurements. For components without FBG strain sensors, the Dead and unit Temperature Load and Wind Load effects of the bridge can be evaluated by the finite element model, updated and calibrated by monitoring data. By applying measured truck loads and axle spacing data from weight in motion (WIM) system to the calibrated finite element model, the Live Load effects of components without FBG sensors can be generated. The stochastic process of Live Load effects can be described approximately by a Filtered Poisson Process and the extreme value distribution of Live Load effects can be calculated by Filtered Poisson Process theory. Then first order reliability method (FORM) is employed to estimate the reliability index of main components of the bridge (i.e. stiffening girder).

Paper Details

Date Published: 20 October 2009
PDF: 8 pages
Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74933B (20 October 2009); doi: 10.1117/12.838666
Show Author Affiliations
Shunlong Li, Harbin Institute of Technology (China)
Hui Li, Harbin Institute of Technology (China)
Jinping Ou, Harbin Institute of Technology (China)
Hongwei Li, Harbin Institute of Technology (China)

Published in SPIE Proceedings Vol. 7493:
Second International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Anand K. Asundi; Wolfgang Ecke, Editor(s)

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