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Proceedings Paper

Stress analysis of shape memory alloy composites
Author(s): Yulong Wang; Limin Zhou; Zhenqing Wang; Haitao Huang; Lin Ye
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Paper Abstract

Shape memory alloys (SMAs), when in the form of wires or short fibers, can be embedded into a host material to form SMA-composite for satisfying a wide variety of engineering requirements. Due to the weak interface strength between the SMA wire and the matrix, the interface debonding often happens when the SMA composites act by external force or actuation temperature or combination of them. It is, therefore, very important to understand the stress transfers between the SMA fibers and matrix and the distributions of internal stresses in the SMA composite in order to improve its properties. In this paper, a theoretical model incorporated with Brinson's constitutive law of SMA for the prediction of internal stresses has been successfully developed. The assumed stress functions which satisfy equilibrium equations in the fiber and matrix respectively and the principle of minimum complementary energy are utilized to analyze the internal stress distributions during fiber pull-out and/or thermal loading processes. The complete axisymmetric states of stresses in the SMA fiber and matrix have been developed. A finite element analysis has been also conducted to compare with the theoretical results.

Paper Details

Date Published: 21 October 2009
PDF: 8 pages
Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 74930J (21 October 2009); doi: 10.1117/12.838636
Show Author Affiliations
Yulong Wang, Harbin Engineering Univ. (China)
The Hong Kong Polytechnic Univ. (Hong Kong, China)
Limin Zhou, The Hong Kong Polytechnic Univ. (Hong Kong, China)
Zhenqing Wang, Harbin Engineering Univ. (China)
Haitao Huang, The Hong Kong Polytechnic Univ. (Hong Kong, China)
Lin Ye, The Hong Kong Polytechnic Univ. (Hong Kong, China)
The Univ. of Sydney (Australia)


Published in SPIE Proceedings Vol. 7493:
Second International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Anand K. Asundi; Wolfgang Ecke, Editor(s)

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