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Proceedings Paper

Digital-pixel focal plane array development
Author(s): Matthew G. Brown; Justin Baker; Curtis Colonero; Joe Costa; Tom Gardner; Mike Kelly; Ken Schultz; Brian Tyrrell; Jim Wey
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Paper Abstract

Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 μm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 μm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology.

Paper Details

Date Published: 23 January 2010
PDF: 10 pages
Proc. SPIE 7608, Quantum Sensing and Nanophotonic Devices VII, 76082H (23 January 2010); doi: 10.1117/12.838314
Show Author Affiliations
Matthew G. Brown, MIT Lincoln Lab. (United States)
Justin Baker, MIT Lincoln Lab. (United States)
Curtis Colonero, MIT Lincoln Lab. (United States)
Joe Costa, MIT Lincoln Lab. (United States)
Tom Gardner, MIT Lincoln Lab. (United States)
Mike Kelly, MIT Lincoln Lab. (United States)
Ken Schultz, MIT Lincoln Lab. (United States)
Brian Tyrrell, MIT Lincoln Lab. (United States)
Jim Wey, MIT Lincoln Lab. (United States)


Published in SPIE Proceedings Vol. 7608:
Quantum Sensing and Nanophotonic Devices VII
Manijeh Razeghi; Rengarajan Sudharsanan; Gail J. Brown, Editor(s)

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