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Proceedings Paper

Motion blurred image restoration algorithm for IC wire bonder
Author(s): Yixin Zhang; Shun Wang; Xuping Zhang; Xuejun Lu
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Paper Abstract

Chip packaging is an important process during IC manufacturing. Wire bonders are key equipments of chip packaging. The manually type of wire bonders can be updated to automatic with a pattern recognition system (PRS). However, the resolution of PRS is quite sensitive to the mechanism's trembling. Additional waiting time has to be taken before the image sensor can take a shoot, which limits the wire bonder's productivity. In this paper, method for motion blurred image restoration is presented. The method uses point spread function (PSF) learning to estimate the degradation function and power spectrum analyze to estimate the image's signal to noise rate (SNR). Experimental results are given to illustrate the proposed image restoration algorithm.

Paper Details

Date Published: 24 November 2009
PDF: 5 pages
Proc. SPIE 7513, 2009 International Conference on Optical Instruments and Technology: Optoelectronic Imaging and Process Technology, 75130C (24 November 2009); doi: 10.1117/12.838152
Show Author Affiliations
Yixin Zhang, Nanjing Univ. (China)
Shun Wang, Nanjing Univ. (China)
Xuping Zhang, Nanjing Univ. (China)
Xuejun Lu, Nanjing Univ. (China)


Published in SPIE Proceedings Vol. 7513:
2009 International Conference on Optical Instruments and Technology: Optoelectronic Imaging and Process Technology
Toru Yoshizawa; Ping Wei; Jesse Zheng, Editor(s)

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