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Proceedings Paper

Dome design and coupled thermal-mechanical analysis of supersonic missile
Author(s): Xing-qiao Ai; Qun Wei; Hong-guang Jia
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Paper Abstract

A review of high-speed flow pressure and aerodynamic heating effect on Supersonic missile's dome is given. The dome should have excellent properties in optical, mechanical and chemical characteristics. A design of dome on supersonic mode is described according to tactical guide line of a missile. The dome made of quartz which is about 8mm thick and 141mm in window diameter. To check up the reliability of the dome, a reasonable finite element model (FEM) of dome is established, and a thermal-mechanical Analysis to the dome by finite element software NASTRAN has carried on, through these can obtained the distribution of temperature field and stress field when the speed is 2.3Ma. The results indicated that the stress was concentrated in the joint of the dome end and the Missile Section, and the maximum stress was 16.4Mpa. The stress of other nodes was smaller than the allowable stress of quartz glass. Reference to the results of the analysis, a lightweight revision to the dome structural dimension and a new method of dome fixing have put forward, which can reduce the stress concentration.

Paper Details

Date Published: 30 November 2009
PDF: 8 pages
Proc. SPIE 7506, 2009 International Conference on Optical Instruments and Technology: Optical Systems and Modern Optoelectronic Instruments, 75061Q (30 November 2009); doi: 10.1117/12.837896
Show Author Affiliations
Xing-qiao Ai, Graduate Univ. of Chinese Academy of Sciences (China)
Changchun Institute of Optics, Fine Mechanics and Physics (China)
Qun Wei, Graduate Univ. of Chinese Academy of Sciences (China)
Changchun Institute of Optics, Fine Mechanics and Physics (China)
Hong-guang Jia, Changchun Institute of Optics, Fine Mechanics and Physics (China)


Published in SPIE Proceedings Vol. 7506:
2009 International Conference on Optical Instruments and Technology: Optical Systems and Modern Optoelectronic Instruments
Yongtian Wang; Yunlong Sheng; Kimio Tatsuno, Editor(s)

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