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Proceedings Paper

Litho-freeze-litho-etch (LFLE) enabling dual wafer flow coat/develop process and freeze CD tuning bake for >200wph immersion ArF photolithography double patterning
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Paper Abstract

The SOKUDO DUO track system incorporates a dual-path wafer flow to reduce the burden on the wafer handling unit and enables high-throughput coat/develop/bake processing in-line with semiconductor photolithography exposure (scanner) equipment. Various photolithography-based double patterning process flows were modeled on the SOKUDO DUO system and it was confirmed to be able to process both Litho-Process-Litho-Etch (LPLE)*2 and negative-tone develop process wafers at greater than 200 wafer-per-hour (wph) capability for each litho-pass through the in-line exposure tool. In addition, it is demonstrated that Biased Hot Plates (BHP) with "cdTune" software improves litho pattern #1 and litho pattern #2 within wafer CD uniformity. Based primarily on JSR Micro materials for Litho-Freeze- Litho-Etch (LFLE) the coat, develop and bake process CD uniformity improvement results are demonstrated on the SOKUDO RF3S immersion track in-line with ASML XT:1900Gi system at IMEC, Belgium.

Paper Details

Date Published: 11 December 2009
PDF: 12 pages
Proc. SPIE 7520, Lithography Asia 2009, 75201H (11 December 2009); doi: 10.1117/12.837221
Show Author Affiliations
Charles N. Pieczulewski, SOKUDO Co., Ltd. (Japan)
Craig A. Rosslee, SOKUDO USA, LLC (United States)

Published in SPIE Proceedings Vol. 7520:
Lithography Asia 2009
Alek C. Chen; Woo-Sung Han; Burn J. Lin; Anthony Yen, Editor(s)

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