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Proceedings Paper

A proven methodology for detecting photo-resist residue and for qualifying photo-resist material by measuring fluorescence using SP2 bare wafer inspection and SURFmonitor
Author(s): David Feiler; Sanda Radovanovic; Prasanna Dighe; Arul Kitnan; Gavin Simpson; Gad Schwager; Alexander Eynis; Diti Enidjer
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Paper Abstract

During the chip making process, complete removal of photo-resist is very critical. Current metrology & analytical methods do not provide enough sensitivity to detect residual amounts of photo-resist remaining on the wafer. Using the novel method described in this study, the Surfscan SP2 and SURFmonitor solution has successfully demonstrated the sensitivity needed to detect residual photo-resist. This method takes advantage of the fact that residual photo-resist, which is organic in nature, will fluoresce. By scanning wafers after the ash and clean step using the SP2 (UV wavelength) unpatterned defect inspection tool equipped with SURFmonitor, it is possible to generate a full-wafer fluorescence SURFimage. This SURFimage was shown to clearly indicate the regions of the wafer where residual photoresist was present.

Paper Details

Date Published: 12 December 2009
PDF: 8 pages
Proc. SPIE 7520, Lithography Asia 2009, 75201M (12 December 2009); doi: 10.1117/12.837020
Show Author Affiliations
David Feiler, KLA-Tencor Corp. (United States)
Sanda Radovanovic, KLA-Tencor Corp. (United States)
Prasanna Dighe, KLA-Tencor Corp. (United States)
Arul Kitnan, KLA-Tencor Corp. (United States)
Gavin Simpson, KLA-Tencor Corp. (United States)
Gad Schwager, Numonyx Israel Ltd. (Israel)
Alexander Eynis, Numonyx Israel Ltd. (Israel)
Diti Enidjer, Numonyx Israel Ltd. (Israel)


Published in SPIE Proceedings Vol. 7520:
Lithography Asia 2009
Alek C. Chen; Woo-Sung Han; Burn J. Lin; Anthony Yen, Editor(s)

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