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Proceedings Paper

The optimizing designing of bi-material micro cantilever with adhesive layer in between and its application in an uncooled MEMS IR FPA
Author(s): Xia Zhang; Bin-bin Jiao; Da-peng Chen; Tian-chun Ye
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Paper Abstract

Bi-material cantilever is an important basic structure in MEMS device. Most of the materials with thermal property fit for bi-material are not adhering together steadily. An adhesive layer in between is needed. In this paper, based on the thermal stress and combined deformation in Mechanics of Materials, a model related to the physics properties, structure dimension, and the tilt angle caused by thermal stress is set up. A research of how to select the materials and how to determinate the thickness and other size of a bi-material cantilever is carry out by this model, further more, an optic read out IR image chip pixel is designed that shows this model is simple and practical.

Paper Details

Date Published: 5 August 2009
PDF: 7 pages
Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73834M (5 August 2009); doi: 10.1117/12.836580
Show Author Affiliations
Xia Zhang, Institute of Microelectronics (China)
Communication Univ. of China (China)
Bin-bin Jiao, Institute of Microelectronics (China)
Da-peng Chen, Institute of Microelectronics (China)
Tian-chun Ye, Institute of Microelectronics (China)


Published in SPIE Proceedings Vol. 7383:
International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications
Jeffery Puschell; Hai-mei Gong; Yi Cai; Jin Lu; Jin-dong Fei, Editor(s)

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