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Proceedings Paper

Development and application of large format QWIP FPA
Author(s): Yan-Li Shi
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Paper Abstract

320×256 GaAs/AlGaAs Quantum Well Infrared Photodetector (QWIP) Focal Plane Array (FPA) was successfully prepared. The material design, device fabrication, performance measurement, as well as thermal imaging by the first QWIP FPA thermal imager was addressed in this paper. Further development and application of large format QWIP FPA detector was also presented. Based on the mature material growth and devices processing technology the large format III-V QWIP focal plane array was characteristic of promising mass production ability with high performance, good repeatability, good uniformity and low cost. Besides, the flexible Energy-Band Engineering of III-V QWIP technology made QWIP FPA as the advanced Third-Gen infrared detector technology now and in the future.

Paper Details

Date Published: 4 August 2009
PDF: 10 pages
Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 738303 (4 August 2009); doi: 10.1117/12.836519
Show Author Affiliations
Yan-Li Shi, Kunming Institue of Physics (China)


Published in SPIE Proceedings Vol. 7383:
International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications
Jeffery Puschell; Hai-mei Gong; Yi Cai; Jin Lu; Jin-dong Fei, Editor(s)

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