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Proceedings Paper

Modeling of wet adhesion of microstructures in shock environment
Author(s): Zhen-Zhong Wang; Qing-An Huang; Jie-Ying Tang
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Paper Abstract

Adhesion, as one of the most common failure modes compromising reliability of optical MEMS devices, attracted great research interests for enhancing the production yields and device reliability. Experiments show that wet-adhesion with respect to capillary force between interfaces of movable structures is generally the dominant figure among all adhesion natures. Great efforts had been made on examine adhered length of micro-cantilevers to modeling adhesion energy, which are reasonable to predict adhesion in quasi static process such as sacrificial layer release processes. However, the microcosmic mechanism of adhesion has not been well revealed, thereby these models are not sufficiently precise for in-situ adhesion, such as adhesion due to mechanical shock. In this work, a novel model of adhesion energy is derived by review the physical mechanisms carefully and shock caused adhesion is studied applying this model.

Paper Details

Date Published: 24 August 2009
PDF: 8 pages
Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73812S (24 August 2009); doi: 10.1117/12.835690
Show Author Affiliations
Zhen-Zhong Wang, Southeast Univ. (China)
Qing-An Huang, Southeast Univ. (China)
Jie-Ying Tang, Southeast Univ. (China)


Published in SPIE Proceedings Vol. 7381:
International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors
Xu-yuan Chen; Yue-lin Wang; Zhi-ping Zhou; Qing-kang Wang, Editor(s)

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