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Proceedings Paper

Research on a novel packaging structure and technology by red copper slice for fiber Bragg gratings
Author(s): Wei-na Wu; Si-dong Li; Wen-hua Wang
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Paper Abstract

The sensing principle of FBG packaged was developed, and packaging technology for fiber Bragg gratings (FBGs) and the embedding technique were studied. A scheme of packaging technology using the red copper slice for FBGs was presented, and experimental results indicate that the strain sensitivity coefficient of FBG packaged is nearly the same as that of the bare FBG, and that the FBG packaged can measure the 1με change, and that the temperature sensitivity coefficient of FBG packaged is 2.97 times as much as that of the bare FBG, and that the packaging structure using red copper slice improves the temperature resolution of demodulation equipment for FBG sensors, and that the FBG packaged sensors can measure the 0.03°C change.

Paper Details

Date Published: 24 August 2009
PDF: 6 pages
Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73811Q (24 August 2009); doi: 10.1117/12.835306
Show Author Affiliations
Wei-na Wu, Guangdong Ocean Univ. (China)
Si-dong Li, Guangdong Ocean Univ. (China)
Wen-hua Wang, Guangdong Ocean Univ. (China)


Published in SPIE Proceedings Vol. 7381:
International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors
Xu-yuan Chen; Yue-lin Wang; Zhi-ping Zhou; Qing-kang Wang, Editor(s)

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