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Proceedings Paper

High speed (>100 Gbps) key components for a scalable optical data link to be implemented in future maskless lithography applications
Author(s): A. Paraskevopoulos; S.-H. Voss; M. Talmi; G. Walf
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Paper Abstract

Maskless lithography based on electron beam parallelization requires well adapted data links, capable of transmitting the corresponding data volume at rates up to the Tbps domain. In this paper we focus on two key components, the high-speed data buffer unit and the integrated optical receiver, which are part of a scalable (24 - 140 Gbps) optical data link. The high-speed buffer design architecture enables the transmission of skew-compensated parallel data in the range of 50 Gbps. The 45-channel low-noise integrated optical receiver chip based on BiCMOS 0.6 micron technology is capable of an overall transmission capacity of 140 Gbps.

Paper Details

Date Published: 27 May 2009
PDF: 8 pages
Proc. SPIE 7470, 25th European Mask and Lithography Conference, 747011 (27 May 2009); doi: 10.1117/12.835200
Show Author Affiliations
A. Paraskevopoulos, Fraunhofer-Institute for Telecommunications (Germany)
S.-H. Voss, Fraunhofer-Institute for Telecommunications (Germany)
M. Talmi, Fraunhofer-Institute for Telecommunications (Germany)
G. Walf, Fraunhofer-Institute for Telecommunications (Germany)


Published in SPIE Proceedings Vol. 7470:
25th European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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