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Proceedings Paper

Improving yield and cycle time at the inspection process by means of a new defects disposition technique
Author(s): Ernesto Villa; Luca Sartelli; Hiroyuki Miyashita; Frank Sundermann; Stuart Gough; Felix Dufaye; Astrid Sippel
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Paper Abstract

The paper describes a new approach of evaluating isolated opaque defects, as well as CD-like defects on hole layer, using features available on the inspection tool. This eliminates further verifications on specific tools, which would result in their overloading and in time consuming, with a potential negative impact on the delivery time of any product going through such processes. In the first case the method consists of associating the effect of a cluster of assist bars to that of isolated opaque defects, considering their size and position on the layout of the mask. In case of CD-like defects on holes the evaluation is based on a thorough characterization of the performance of the Litho2 detector of the Terascan T576 and its further verification with the AIMS readings.

Paper Details

Date Published: 27 May 2009
PDF: 13 pages
Proc. SPIE 7470, 25th European Mask and Lithography Conference, 74700T (27 May 2009); doi: 10.1117/12.835191
Show Author Affiliations
Ernesto Villa, DNP Photomask Europe S.p.A. (Italy)
Luca Sartelli, DNP Photomask Europe S.p.A. (Italy)
Hiroyuki Miyashita, DNP Photomask Europe S.p.A. (Italy)
Frank Sundermann, STMicroelectronics (France)
Stuart Gough, STMicroelectronics (France)
Felix Dufaye, STMicroelectronics (France)
Astrid Sippel, KLA-Tencor SARL (France)


Published in SPIE Proceedings Vol. 7470:
25th European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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