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Proceedings Paper

Structure design and simulation of uncooled infrared sensors
Author(s): Yuanqing Wu; Suying Yao; Peng Gao; Hongwei He
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Paper Abstract

This paper deals with a complete analytical modeling and analysis of thermoelectric uncooled infrared sensors compatible with CMOS technology. The model put forward is based on dividing the sensor into three zones, each one being the subject of a thorough thermal study (conduction, convection and radiation thermal effect). Through the analytical thermal gradient analysis developed in each zone of the structure (absorber, part of thermoelectric transducer layer placed under the absorber, thermoelectric transducer) we are able to predict the sensitivity, detectivity and the stability power to the sensor. Thus, such a kind of analytical approach is worth of interest to optimize thermopile sensor design parameters.

Paper Details

Date Published: 5 August 2009
PDF: 7 pages
Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73832I (5 August 2009); doi: 10.1117/12.834972
Show Author Affiliations
Yuanqing Wu, Tianjin Univ. (China)
Suying Yao, Tianjin Univ. (China)
Peng Gao, Tianjin Univ. (China)
Hongwei He, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 7383:
International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications
Jeffery Puschell; Hai-mei Gong; Yi Cai; Jin Lu; Jin-dong Fei, Editor(s)

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