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Proceedings Paper

Optical analysis of thermo-optic infrared focal plane array
Author(s): X. Yan; F. Feng; Y. L. Wang
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Paper Abstract

Optical characteristic of an infrared focal plane array (FPA) based on thermo-optic effect is analyzed using film optics method. Then, an optimizing film assembly of thermo-optic infrared focal plane array (TOFPA) described as air|<HL>230.1H<LH>216L|substrate is obtained with its temperature sensitivity 6.23% K-1. Furthermore, the influence of substrate material, device package and absorption is discussed. The results show that the temperature sensitivity of the film assembly of TOFPA is modulated by 16.4%, 8.99%, -11.3 %, and -0.6% with the influence of glass substrate, silicon substrate, glass package and optical absorption of film material, respectively.

Paper Details

Date Published: 5 August 2009
PDF: 6 pages
Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73834S (5 August 2009); doi: 10.1117/12.834912
Show Author Affiliations
X. Yan, Shanghai Institute of Microsystem and Information Technology (China)
Graduate School of the Chinese Academy of Sciences (China)
F. Feng, Shanghai Institute of Microsystem and Information Technology (China)
Y. L. Wang, Shanghai Institute of Microsystem and Information Technology (China)


Published in SPIE Proceedings Vol. 7383:
International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications
Jeffery Puschell; Hai-mei Gong; Yi Cai; Jin Lu; Jin-dong Fei, Editor(s)

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