Share Email Print
cover

Proceedings Paper

Integrated thermoelectric infrared sensor with XeF2 etching
Author(s): De-hui Xu; Bin Xiong; Yue-lin Wang; Mi-feng Liu
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, the design, simulation, fabrication and testing of an integrated thermoelectric infrared sensor have been demonstrated. The integrated thermoelectric sensor has been fabricated by a standard p-well CMOS technology and a maskless XeF2 post-CMOS micromachining process. The modeling of the infrared sensor has been performed numerically using FEM method. With a 2.5 μm thick stacked silicon oxide-nitride-oxide multi-layers as absorber, the prototype sensor achieved a responsivity of 14.7 V W-1, a specific detectivity of 4.07 × 107 cm Hz1/2 W-1 and a time constant about 23 ms. The effects of XeF2 etching on the CMOS devices have also been studied. XeF2 post-CMOS micromachining was found to have insignificant effects on CMOS devices.

Paper Details

Date Published: 24 August 2009
PDF: 7 pages
Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73812M (24 August 2009); doi: 10.1117/12.834699
Show Author Affiliations
De-hui Xu, Shanghai Institute of Microsystem and Information Technology (China)
Graduate School of the Chinese Academy of Sciences (China)
Bin Xiong, Shanghai Institute of Microsystem and Information Technology (China)
Yue-lin Wang, Shanghai Institute of Microsystem and Information Technology (China)
Mi-feng Liu, Shanghai Institute of Microsystem and Information Technology (China)
Graduate School of the Chinese Academy of Sciences (China)


Published in SPIE Proceedings Vol. 7381:
International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors
Xu-yuan Chen; Yue-lin Wang; Zhi-ping Zhou; Qing-kang Wang, Editor(s)

© SPIE. Terms of Use
Back to Top