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Proceedings Paper

The controlling of microlens contour by adjusting developing time in the thermal reflow method
Author(s): Si Di; Ru-xu Du
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Paper Abstract

As one of widely used microlens fabrication techniques, thermal reflow method has many advantages such as simple fabrication process, low price, and good smoothness of the microlens. However, it is difficult to predict and control the final microlens contour after melting process. In this paper, we pay our attention on searching a method to control the microlens contour. The relationship between microlens contour and developing time is studied by experiments in the case of insufficient developing. When the developing time is not sufficient, some of the photoresist will be left on the substrate. In that case, the contact angle of microlens, which decided by the ratio of microlens aperture on its curvature radius, is smaller comparing with the case of completely development. The experimental results indicate that different developing time will result in different contact angle of the microlens after the melting process. Therefore, it is enables to control microlens contour by adjusting developing time. The experimental results also indicate that the degree of microlens contour deviate from ideal spherical is related to developing time. These results are valuable for us to fabricate the microlens which has expected geometrical shape.

Paper Details

Date Published: 24 August 2009
PDF: 7 pages
Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73811D (24 August 2009); doi: 10.1117/12.833943
Show Author Affiliations
Si Di, Shenzhen Institute of Advanced Integration Technology (China)
Chinese Univ. of Hong Kong (China)
Ru-xu Du, Shenzhen Institute of Advanced Integration Technology (China)
Chinese Univ. of Hong Kong (China)


Published in SPIE Proceedings Vol. 7381:
International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors
Xu-yuan Chen; Yue-lin Wang; Zhi-ping Zhou; Qing-kang Wang, Editor(s)

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