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Proceedings Paper

Electro-rheological finishing for optical surfaces
Author(s): Haobo Cheng; Peng Wang
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Paper Abstract

Many polishing techniques such as fixed-abrasive polishing, abrasive-free polishing and magnetorheological finishing etc., have been developed. Meanwhile, a new technique is proposed using the mixture of the electro-rheological (Er) fluid with abrasives as polishing slurry, which is a special process does not require pad. Electrorheological fluid is a special suspension liquid, whose viscosity has an approximate proportional relation with the electric strength applied. When the field strength reaches a certain limit, the phase transition occurs and the liquid acquires a solid like character, and while the electric field is removed, the fluid regains its original viscosity during the order of milliseconds. In this research work, we employed the characteristics of viscosity change of Er fluid to hold the polishing particles for micromachining. A point-contact electro-rheological finishing (Erf) tool was designed with a tip diameter 0.5~1mm. Both the anode and the cathode of the electric field were combined in the tool. The electric field could be controllable. When the tool moves across the profile of the work piece, by controlling the electric field strength as well as the other manufacturing parameters we can assure the deterministic material removal. Furthermore, the electro-rheological finishing process has been planned in detailed.

Paper Details

Date Published: 21 May 2009
PDF: 6 pages
Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 72823P (21 May 2009); doi: 10.1117/12.831068
Show Author Affiliations
Haobo Cheng, Beijing Institute of Technology (China)
Peng Wang, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 7282:
4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; John M. Schoen; Yoshiharu Namba; Shengyi Li, Editor(s)

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