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Proceedings Paper

Effects of velocity and pressure distributions on material removal rate in polishing process
Author(s): Yaguo Li; Jian Wang; Qaio Xu; Wei Yang; Yinbiao Guo
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Paper Abstract

The distributions of velocity and pressure during polishing process are analyzed in this paper and the effects of which on material removed/removal rate (MR/MRR) are discussed. Usually, polished wafer moves in planetary kinematics pattern, and when the rotation rate of wafer is identical with that of polishing pad the velocity distribution is theoretically uniform from the viewpoint of wafer-pad interface as a whole. On the other hand, when a load is applied to the top surface of wafer pressure distribution is even in the interior of wafer while the pressure sharply increases at the wafer's border, which will inevitably affect the non-uniformity (NU) of MR/MRR, and therefore we have to adjust other parameters, such as rotation rate of pad (or wafer) or improve motion pattern of wafer with respect to polishing pad, to optimize the NU.

Paper Details

Date Published: 21 May 2009
PDF: 7 pages
Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 72820G (21 May 2009); doi: 10.1117/12.830798
Show Author Affiliations
Yaguo Li, Chengdu Fine Optical Engineering Research Ctr. (China)
Jian Wang, Chengdu Fine Optical Engineering Research Ctr. (China)
Qaio Xu, Chengdu Fine Optical Engineering Research Ctr. (China)
Wei Yang, Xiamen Univ. (China)
Yinbiao Guo, Xiamen Univ. (China)


Published in SPIE Proceedings Vol. 7282:
4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; John M. Schoen; Yoshiharu Namba; Shengyi Li, Editor(s)

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